Product Information

• Designed for the lamination of Melamine and ABS decorative boards.
• 100% solid content, solvent-free, and safe for use.
• Low viscosity allows for low-temperature operation at approximately 100-150°C.
• Single-component reactive type (moisture-curing).
• Exhibits excellent initial bond strength.
• Good bonding strength to Melamine, ABS, and wood-based panels.
• Good water resistance.
• Exhibits excellent weather resistance and material stability after reaction.
• Excellent stability during machine operation.