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Industries
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Electronics Assembly
Automotive Assembly
Woodworking Lamination
Textile Lamination
Low Pressure Molding (LPM)
Hot Melt Gel for Sealing & Gapping
Battery Assembly
Paper Products
Case & Carton Sealing
Pressure Sensitive Adhesives (PSA)
Other Applications
Form-In-Place Gaskets (FIPG)
Products & Services
＋
–
Moisture-Reactive Polyurethane Hot Melt (PUR)
Electronic Grade Moisture-Reactive Polyurethane Hot Melt (PUR)
Low Pressure Molding (LPM) Reactive Adhesives
Food-Grade Direct Contact Adhesives
Two-Component Polyurethane Potting Compounds
Hot Melt Adhesives
Gel-state Hot Melt Adhesives
Wetness Indicator Water-Soluble Hot Melts
Water-Based Adhesives
Two-Component Acrylic Structural Adhesives
Modified Silicone Adhesives
Epoxy Adhesives
Solvent-Based Adhesives
Adhesive Remover
UV-Curable Gasket Adhesives
Two-Component Gasket Adhesives
Heat-Curable Gasket Adhesives
Technical Lab
News
About FARTACK
Contact
English
＋
–
正體中文
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Electronic Assembly Applications
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Low Pressure Molding (LPM) Applications
Hot Melt Gel for Sealing and Gapping Applications
Battery Assembly Applications HTML
Paper Products Applications
Carton and Color Box Bonding Applications
Pressure Sensitive Adhesive (PSA) Applications
Other Applications
Cured-In-Place Gasket (CIPG) Adhesives
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