To achieve waterproofing and moisture protection, automotive electronic components have traditionally used Epoxy potting. However, Epoxy-potted components are heavy, bulky, slow-forming, and raise concerns regarding hazardous substances, making them unable to meet the lightweight and compact trends of the electric vehicle (EV) market. Additionally, conventional low-pressure molding materials like Polyamide and TPU often fail rigorous automotive weatherability tests due to poor bonding and sealing performance. To solve these issues, FARTACK TECHNOLOGY has developed an eco-friendly, single-component, solvent-free Low Pressure Molding RR (Reactive Resin) hot melt adhesive. This product features moisture-reactive properties that create superior bonding and sealing effects with various materials while providing excellent protection for electronic components. This allows it to meet requirements for waterproofing, moisture-proofing, dust-proofing, resistance to high and low temperatures, and impact resistance, while passing stringent automotive weatherability tests. We provide customers with diversified products and customized development services, including products with specific colors, insulation, thermal conductivity, and flame retardancy properties.