Product Information

• Exhibits excellent initial bond strength; prevents board warping after lamination.
• Suitable for high-speed machinery.
• 100% solid content, solvent-free, and safe for use.
• Low viscosity allows for low-temperature operation at approximately 100-150°C.
• Single-component reactive type (moisture-curing).
• Good bonding strength to PVC, Melamine, and raw wood boards.
• Good water resistance.
• Exhibits excellent weather resistance and material stability after reaction.
• Excellent stability during machine operation.