Product Information

• Black low-pressure injection RR (Reactive Resin) type hot-melt adhesive.
• Can replace Epoxy potting to achieve lightweight design.
• 100% solid content, solvent-free, and safe for use.
• Excellent bonding strength to PCB and PVC materials.
• Low viscosity allows for low-temperature injection operation (approx. 120-150°C).
• Superior injection characteristics with fast de-molding.
• Single-component moisture-curing reactive type.
• Good waterproofing and sealing properties.
• Outstanding weathering resistance and material stability after curing.