White, high-viscosity, high thermal conductivity, and high-adhesion modified silicone.
Thermal conductivity: 1.70W/mK.
Single-component, room-temperature operation.
Suitable for various electronic and electrical assembly, fixing, bonding, sealing, or automotive lighting assembly applications requiring thermal conductivity.
100% solid content, solvent-free, and safe to use.
Moisture-cure mechanism with low odor.
Does not release low-molecular-weight siloxane compounds, preventing contamination of electronic components.
Low shrinkage after reaction.
Excellent bonding and sealing properties on metals such as aluminum, galvanized parts, stainless steel, and iron.
Superior adhesion characteristics to glass.
Good adhesion to various plastic materials such as PC, ABS, PMMA, Nylon, and PVC.
Outstanding resistance to aging, UV light, and weathering.